Japan’s Rapidus hit a key milestone on its path to 2nm mass production by 2027, as it announced on July 18 that prototyping has begun for its 2nm gate-all-around (GAA) chips at the IIM-1 foundry in Chitose, Hokkaido. The company also confirmed that initial test wafers have entered electrical testing, as per its press release.
EUV Plans
Bloomberg, citing Rapidus CEO Atsuyoshi Koike, suggests that the success was driven by the swift installation of extreme ultraviolet (EUV) lithography equipment. Koike highlighted the achievement, saying that there’s no precedent in the world for completing a successful EUV exposure just three months after equipment delivery.
Rapidus received its first EUV lithography machine at New Chitose Airport in December 2024—the first of its kind in Japan, according to Nikkei. On April 1, the company successfully completed EUV exposure, approximately three months after the equipment was delivered, as noted in its press release.
Backed by government support, the company plans to install a total of 10 EUV tools at its advanced chip plants, reports Nikkan Kogyo Shimbun.
In addition, by the end of FY25, Rapidus plans to deliver a Process Design Kit (PDK) to customers, allowing them to begin designing their own chips, Bloomberg suggests. Read More